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high efficacy uv led emitter lz1 - 0 0 u a 05 key features ? hi gh e fficacy 5 w uv led ? ultra - s mall foot print C 4.4 mm x 4.4 mm x 3. 2 mm ? surface mount ceramic package with integrated glass lens ? very low thermal resistance ( 5.5 c/w) ? very h igh radiant f lux densi ty ? new i ndus t ry standard for radiometric power maintenance (>90% at 10 0,000 hours) ? new industry standard for autoclave (135c, 2 atm, 100% rh, 168 hours) ? jedec level 2 for moisture sensitivity level ? lead (pb) f ree and rohs compliant ? r eflow solderable (up t o 6 cycles) ? emitter available on standard or miniature mcpcb ( option al) typical applications ? dental curing and teeth whitening ? sterilization and medical ? dna g el description the lz1 - 00u a 05 uv led emitter provides superior radiometric power in the wavele ngth range specifically required for sterilization, dental curing light s , and numerous medical applications. with a 4.4mm x 4.4mm x 3. 2 mm ultra - small footprint, this package provides exceptional optical power density . the radiometric power performance an d optimal peak wavelength of this led are matched to the response curves of dental resins, resulting in a significantly reduced curing time. the patent ed design has unparalleled thermal and optical performance. the high quality materials used in the packa ge are chosen to optimize l ight output , have excellent uv resistance, and minimize stresses which results in monumental reliability and radiant flux maintenance. led engin, inc. uv radiation avoid exposure to the beam wear protective eyewear
led engin, inc. 2 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) table of contents product nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 ipc/jedec moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 average radiometric power maintenance projections. . . . . . . . . . . . . . . . . . . . . . . . . . 3 radi ant flux binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 peak wavelength binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 forward voltage binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 optical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 pin - out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 recommended solder pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 reflow soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 typical radia tion pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 typical relative spectral power distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 typical peak wavelength shift over temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 typical normalized radiant flux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 typical normalized radiant flux over temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 typical forward current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 current derating curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 emitter tape & reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 company information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2
led engin, inc. 3 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) product nomenclature the lz series part number designation is defined as follows: l z a C b c d e f g - h j k l where: a C designates the number of led die in the package (1 for 5w) b C designates the package level (0 for emitter) c C designates the radiation pattern (0 for lambertian) d and e C designate the color (ua - typical uv peak wavelength = 40 0 nm) f and g C designate the power (05 for 5w typical rating) h C designates the radiant flux bin (see table 2) j and k C designate the peak wavelength bin (see table 3) l C designates the v f bin (see table 4) ordering information: for ordering ledengin product s, please reference the base part number. the base part number represents any of the radiant flux, peak wavelengt h, or forward voltage bins specified in the binning tables below. for ordering product s with special bin selections , please contact a ledengin sales representative or authorized distributor. ipc/jedec m oisture sensitivity level table 1 - ipc/jedec j - s td - 20d.1 msl classification: soak requirements floor life standard accelerated level time conditions time (hrs) conditions time (hrs) conditions 2 1 year 30c/ 60 % rh 168 +5/ - 0 85c/ 60 % rh n/a n/a notes for table 1 : 1. the standard soak time includ es a default value of 24 hours for semiconductor manufacturers exposure time (met) between bake and bag and the floor life of maximum time allowed out of the bag at the end user of distributors facility. average radiant flux maintenance projections b ased on long - term whtol testing, ledengin projects that the lz series will deliver, on average, 90% radiant flux maintenance at 100,000 hours of operation at a forward current of 7 00 ma. this projection is based on constant current operation with junction tempera ture maintained at or below 11 5c. base part number bin code
led engin, inc. 4 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) radi ant flux bin s table 2 : bin code minimum radiant flux () @ i f = 7 00ma [1,2] (mw) maximum radiant flux () @ i f = 7 00ma [1,2] (mw) typical radiant flux () @ i f = 1 0 00ma [2] (mw) h 410 512 620 j 512 6 40 740 k 640 800 920 notes for table 2 : 1. radiant flux performance guaranteed within published operating conditions. ledengin maintains a tolerance of 10% o n flux measurements. 2. future products will have even higher levels of radia nt flux performance. contact ledengin sales for updated information. peak w avelength bin s table 3 : bin code minimum peak wavelength ( p ) @ i f = 7 00ma [1] (nm) maximum peak wavelength ( p ) @ i f = 7 00ma [1] (nm) u5 390 395 u6 395 400 u7 400 405 u8 405 41 0 notes for table 3: 1. ledengin maintains a tolerance of 2.0 nm on peak wavelength measurements. forward voltage bins table 4 : bin code minimum forward voltage ( v f ) @ i f = 7 00ma [1] (v) maximum forward voltage (v f ) @ i f = 7 00ma [1] (v) 0 3.20 4.40 notes for table 4 : 1. ledengin maintains a tolerance of 0.0 4 v for forward voltage measurements.
led engin, inc. 5 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) absolute maximum ratin gs table 5 : parameter symbol value unit dc forward current [1] i f 1 0 00 ma peak pulsed forward current [2] i fp 1 0 00 ma reverse voltage v r see note 3 v storage temperature t stg - 40 ~ +150 c junction temperature t j 1 25 c soldering temperature t sol 1 8 0 c allowable reflow cycles 6 autoclave conditions 121 c at 2 atm, 100% rh for 168 hours esd sensitivity [4 ] > 1 ,000 v hbm class 2 jesd22 - a114 - d notes for table 5 : 1. maximum dc forward current is determined by the overall thermal resistance a nd ambient temperature . follow the curves in figure 10 for current derating. 2 : pulse forward current conditions: pulse width 10msec and duty cyc le 10% . 3. leds are not designed to be reverse biased. 4 . ledengin recommends taking reasonable precautions towards possible esd damages and handling the lz1 - 00ua05 in an electrostatic protected area (epa). an epa may be adequately protected by esd controls as outlined in ansi/esd s6.1. optical characteristics @ t c = 25c table 6 : parameter symbol typical unit radiant flux (@ i f = 7 00ma) 46 0 mw radiant flux (@ i f = 1 0 00ma) 59 0 mw peak wavelength [1] p 4 0 0 nm viewing angle [ 2 ] 2 1/2 8 5 degrees total included angle [ 3 ] 0.9v 10 0 degrees notes for table 6 : 1. when operating the uv led, observe iec 60825 - 1 class 3b rating. avoid exposure to the beam. 2. viewing angle is the off axis angle from emitter cen terline where the radiometric power is ? of the peak value. 3. total included angle is the total angle that includes 90% of the total radiant flux. electrical characteristics @ t c = 25c table 7 : parameter symbol typical unit forward voltage (@ i f = 7 00ma) v f 3.9 v forward voltage (@ i f = 1 0 00ma) v f 4. 1 v temperature coefficient of forward voltage v f /t j - 3 . 7 mv/c thermal resistance (junction to case ) r j - c 5.5 c/w
led engin, inc. 6 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) 1 2 3 4 5 mechanical dimensions (mm) pin out pad function 1 cathode 2 anode 3 anode 4 cathode 5 [2] thermal figure 3: package o utline d ra wing. notes for figure 3: 1. unless otherwise noted, the tolerance = 0.20 mm. 2. thermal contact, pad 5, is electrically connected to the anode, pads 2 and 3. do not electrically connect any electrical pads to the thermal contact, pad 5. ledengin recommends mounting the lz1 - 00 ua 05 to a mcpcb that provides insulation between all electrical pads and the thermal contact, pad 5. ledengin offers lz1 - 10 ua 05 and lz1 - 30 ua 05 mcpcb options which provide both electrical and thermal contact insulation with low thermal resistance. please refer to application note mcpcb options 1 and 3, or contact a ledengin sales representative for more information. recommended solder pad layout (mm) figure 4: recommended solder mask opening (hatched area) for ano de, cathode, and thermal pad. note for figure 4: 1. unless otherwise noted, the tolerance = 0.20 mm.
led engin, inc. 7 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) r eflow soldering profile figure 3 : reflow s oldering p rofile for lead free soldering . typical radiation pattern figure 4 : typical r epresentative s patial r adiation p attern. 0 10 20 30 40 50 60 70 80 90 100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angular displacement (degrees) relative intensity (%)
led engin, inc. 8 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) typical relative spectral power distribution figure 5 : typical r elative s pectral p ower vs. w avelength @ t c = 25c. typical peak wavelength shift over temperature figure 6 : typical peak w avelength shift vs. case temperature. 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 300 350 400 450 500 wavelength (nm) relative spectral power 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 20 40 60 80 100 120 case temperature (oc) peak wavelength shift (nm)
led engin, inc. 9 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) typical normalized radiant flux figure 7 : typical normalized radiant flux vs. forward current @ t c = 25c. typical normalize d radiant flux over temperature figure 8 : typical normalized radiant flux vs. case t emperature. 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 200 400 600 800 1000 i f - forward current (ma) normalized radiant flux 0 0.2 0.4 0.6 0.8 1 1.2 0 20 40 60 80 100 120 case temperature (oc) normalized radiant flux
led engin, inc. 10 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) typical forward current characteristics figure 9 : typical forward current vs. forward voltage @ t c = 25c. current derating figure 10 : maximum forward current vs. ambient temperature based on t j( max) = 1 25 c. note s for figure 10: 1. r j - c [junction to case thermal resistance] for the lz1 - 00ua05 is typically 5.5 c/w. 2. r j - a [junction to ambient thermal resistance] = r j - c + r c - a [case to ambient thermal resistance] . 0 200 400 600 800 1000 1200 2.5 3.0 3.5 4.0 4.5 5.0 v f - forward voltage (v) i f - forward current (ma) 0 200 400 600 800 1000 1200 0 25 50 75 100 125 maximum ambient temperature ( oc ) i f - maximum current (ma) r j-a = 9 c / w r j-a = 11 c / w r j-a = 13 c / w 700 (rated)
led engin, inc. 11 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) emitter tape and reel specifications (mm) fig ure 11: emitter carrier tape specifications (mm). figure 12: emitter r eel specifications (mm). notes: 1. reel quantity minimum: 100 emitters. reel quantity maximum: 2000 emitters
led engin, inc. 12 lz1 - 0 0 u a 05 ( r.2 . 7 C 101 2 1 4 ) company information ledengin, inc. is a sili con valley based solid - state lighting company specializing in the development and manufacturing of unprecedented high - power led emitters, modules and replacement lamps. ledengins packaging technologies lead the industry with products that feature lowest thermal resistance, highest flux density and consummate reliability, enabling c ompact and efficient solid state lighting solutions. ledengins led emitters range from 3w to 90w with ultra - compact footprints and are available in single color products inclu ding cool white, neutral white, warm white, red, green, blue, amber, deep red, far red, dental blue and uv as well as multi - color products with rgb, rgba and rgbw options . ledengins brightest whit e leds are capable of emitting 5 , 5 00 lumens. ledengins r obust emitters are at the core of its unique line of modules and replacement lamps producing unmatched beam quality resulting in true lux on target? for a wide variety of spot and narrow flood directional lighting applications. ledengin is committed to pr oviding products that conserve natural resources and reduce greenhouse emissions. ledengin reserves the right to make changes to improve performance without notice. please contact sales@ledengin.com or (408) 4 92 - 0620 for more information.

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